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ADATA XPG Gaming V2.0 4GB, DDR3 DIMM Gaming Memory

$110.48$80.35 (27% OFF)

ADATA XPG Gaming V2.0 4GB, DDR3 DIMM Gaming Memory

$110.48

$80.35

(27% OFF)
+ About the product:

Brand: ADATA

Series: XPG V2.0

Capacity: 2X4GB

Transfer Rate: DDR3-1866MHz

Bus Type: PC3-14900

CAS: CL9

Pins: 240

Product Type: Memory

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Select Size: 2X4GB CAS9

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ADATA XPG Gaming V2.0 4GB, DDR3 DIMM Gaming Memory
ADATA XPG Gaming v2.0 Series memory kit. With TCT (Thermal Conductive Technology), the extended heat sink and 2OZ double-copper 8-layer PCB (Printed Circuit Board), the XPG Gaming v2.0 Series provides remarkable performance and enhanced reliability. The DATA XPG Gaming v2.0 Series AX3U1866GC4G9B-DG2 is rated at 1866Hz and 9-11-9-27 timing at 1.65V for fast system response when battle heats up. The XPG Gaming v2.0 modules include 2OZ double-copper PCB to efficiently improve current transfer rates while lowering the system temperature and increasing system stability. The PCB is also designed with 8-layer, Each XPG Gaming v2.0 Series memory chip is selected through a strict filtering process for reliable performance and higher overclocking potential. Thermal Conductive Technology, which aligns the surface of the memory chip to make direct contact with the heat sink, immediately dispersing heat away from the heat source. The extruded heat sink extends to increase surface area, providing superior thermo-conductor capability, reducing power consumption and elevating the signal completion emitted from the memory module.
- Description
ADATA XPG Gaming v2.0 Series memory kit. With TCT (Thermal Conductive Technology), the extended heat sink and 2OZ double-copper 8-layer PCB (Printed Circuit Board), the XPG Gaming v2.0 Series provides remarkable performance and enhanced reliability. The DATA XPG Gaming v2.0 Series AX3U1866GC4G9B-DG2 is rated at 1866Hz and 9-11-9-27 timing at 1.65V for fast system response when battle heats up. The XPG Gaming v2.0 modules include 2OZ double-copper PCB to efficiently improve current transfer rates while lowering the system temperature and increasing system stability. The PCB is also designed with 8-layer, Each XPG Gaming v2.0 Series memory chip is selected through a strict filtering process for reliable performance and higher overclocking potential. Thermal Conductive Technology, which aligns the surface of the memory chip to make direct contact with the heat sink, immediately dispersing heat away from the heat source. The extruded heat sink extends to increase surface area, providing superior thermo-conductor capability, reducing power consumption and elevating the signal completion emitted from the memory module.

- Reviews