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ADATA XPG Gaming V2.0 8GB (2X4GB) PC3-12800 DDR3-1600MHz CL9 240-Pin Memory

$110.48$80.35 (27% OFF)

ADATA XPG Gaming V2.0 8GB (2X4GB) PC3-12800 DDR3-1600MHz CL9 240-Pin Memory

$110.48

$80.35

(27% OFF)
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Details
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Speed: 1600MHz

Capacity: 8GB (2X4GB)

-
+
1600MHz
1600MHz
1866MHz
2400MHz / CL10
2400MHz / CL11
2400MHz

+ About the product:

Brand: ADATA

Series: XPG V2.0

Capacity: 2X4GB

Transfer Rate: DDR3-1600MHz

Bus Type: PC3-12800

CAS: CL9

Pins: 240

Product Type: Memory

ADATA XPG Gaming V2.0 8GB (2X4GB) PC3-12800 DDR3-1600MHz CL9 240-Pin Memory
ADATA XPG Gaming v2.0 Series memory kit. With TCT (Thermal Conductive Technology), the extended heat sink and 2OZ double-copper 8-layer PCB (Printed Circuit Board), the XPG Gaming v2.0 Series provides remarkable performance and enhanced reliability. The DATA XPG Gaming v2.0 Series AX3U1600GC4G9-DG2 is rated at 1600MHz and 9-9-9-24 timing at 1.65V for fast system response when battle heats up. The XPG Gaming v2.0 modules include 2OZ double-copper PCB to efficiently improve current transfer rates while lowering the system temperature and increasing system stability. The PCB is also designed with 8-layer, Each XPG Gaming v2.0 Series memory chip is selected through a strict filtering process for reliable performance and higher overclocking potential. Thermal Conductive Technology, which aligns the surface of the memory chip to make direct contact with the heat sink, immediately dispersing heat away from the heat source. The extruded heat sink extends to increase surface area, providing superior thermo-conductor capability, reducing power consumption and elevating the signal completion emitted from the memory module.
- Description
ADATA XPG Gaming v2.0 Series memory kit. With TCT (Thermal Conductive Technology), the extended heat sink and 2OZ double-copper 8-layer PCB (Printed Circuit Board), the XPG Gaming v2.0 Series provides remarkable performance and enhanced reliability. The DATA XPG Gaming v2.0 Series AX3U1600GC4G9-DG2 is rated at 1600MHz and 9-9-9-24 timing at 1.65V for fast system response when battle heats up. The XPG Gaming v2.0 modules include 2OZ double-copper PCB to efficiently improve current transfer rates while lowering the system temperature and increasing system stability. The PCB is also designed with 8-layer, Each XPG Gaming v2.0 Series memory chip is selected through a strict filtering process for reliable performance and higher overclocking potential. Thermal Conductive Technology, which aligns the surface of the memory chip to make direct contact with the heat sink, immediately dispersing heat away from the heat source. The extruded heat sink extends to increase surface area, providing superior thermo-conductor capability, reducing power consumption and elevating the signal completion emitted from the memory module.

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